The HR-300 is an extremely user-friendly convection oven suitable for lead-free SMD soldering of printed circuit boards.

It has many advantages especially fully controlled reflow cycle in closed oven!

The special feature of this reflow oven is that the complete cycle takes place in a closed oven.
We have 2400W heating power and hot air circulation to ensure even heat distribution.
Even complicated components like GPS antennas or BGA's can be soldered very well.
As this reflow oven has an exhaust fan, the exhaust gases can be exhausted from the room via a 100mm hose.
All parameters are easy to set and only the temperature to be reached and the dwell time have to be set.

The duration of the heating phase is dynamic until the target temperature is reached, then the fixed holding time expires.
A special feature is the controlled cooling which also reheats when the temperature drops too quickly.
Our HR-300 reflow oven is the perfect solution for prototype production and as a supplement to a vapour phase.

The constant temperature mode can be used to bake components!

Ovens are shipping from Germany.

Reflow oven chamber size is 400x310mm.

New 110V / 1800W version added!

Please ask sunny@smallsmt.biz for download password.

All parts soldered fine except the IC's inside the copper plane but this is an design issue.