A method for manufacturing PCB conductive patterns via selective deposition of conductive material (copper, solder, etc.) on a substrate.
The attraction force between materials of unlike composition.
AUTOMATIC TEST EQUIPMENT (ATE)
Hardware that automatically analyzes functional or static parameters for performance. It also may be designed to automatically check assemblies for fault isolations or individual components for functional integrity.
BALL GRID ARRAY (BGA)
An IC package with solder balls that are arranged in a grid pattern and act as the input/output points.
PCBs held together with breakaway tabs to make handling, placement and soldering easier and more efficient. Boards are snapped apart at the end of processing.
A technique to electrically stress devices to detect possible failures before mounting them in assemblies.